CLEANING PROCESS CONSIDERATIONS FOR ADVANCED PACKAGING DEVICES AND ASSEMBLY

摘要

There has been significant evolution of both cleaning requirements and solutions over the past few years. As Flip Chip I/O counts continue to increase, reliability concerns have renewed design engineers interest to study the benefits of removing flux residue. The purpose of this paper reports advanced cleaning process research to open the process window when cleaning flux residues from beneath low stand off devices. The paper will focus on advanced cleaning fluid and mechanical impingement design factors that open the process window. Data will be presented from comprehensive, ongoing studies designed to evaluate the match between soldering and cleaning technologies across a broad range of process technology equipment options.