PACKAGE ASSEMBLY FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, CAPABLE OF IMPROVING WORKABILITY BY OMITTING A GATE ELIMINATING PROCESS AND A CLEANING PROCESS AFTER A MOLDING PROCESS

摘要

PURPOSE: A package assembly for manufacturing a semiconductor package is provided to rapidly implement the molding process of the semiconductor package by forming a bridge for a resin between semiconductor packages.;CONSTITUTION: A lead frame(110) is based on conductive metal. A plurality of packages(120) is constantly arranged in the lead frame. A bridge(140) connects the packages. A package is composed of a package body(121) and a light emitting diode chip diode on the upper side of the package body. The light emitting diode chips is in electrical connection with the lead electrode of the lead frame.;COPYRIGHT KIPO 2011