FROM PRINTING TO REFLOW: PROCESS DEVELOPMENT FOR 01005 ASSEMBLY

摘要

This work will present a history of stencil printing research we have been conducting over the past several years tha takes us from stencil design and fabrication techniques, to more recent work on area ratio guidelines, solder paste selection, pad orientation and stencil aperture shape directed at 0201 and 01005 assembly processes. The paper will also detail process development of 01005 assembly that not only revolves around the stencil printing process but describe developments in the reflow process step, employing design of experiments (DOE).