Mass Reflow Assembly of 01005 Resistors

摘要

Assembly process concerns between 0201 and 01005 are similar; however, the common ation is the smaller 01005 should be more sensitive to process and design variables. Several articles published on 01005 assembly commonly recommended fine powder solder paste (Type 4 or 5) in conjunction with a thin stencil (0.003"). This work challenges two previous recommendations and attempts to prove or disprove that 01005 assembly process can be performed with Type 3 powder size standard solder paste material using a 0.004"-thick stencil.