RELIABILITY ASSESSEMENT OF EMBEDDED CHIP BUILD-UP BGA PACKAGES

摘要

The Embedded Chip Build-Up (ECBU) packaging technology is able to meet the aggressive performance; reliability and package assembly yield challenges for the next generation of high-end semiconductor devices. This paper presents an overview of the ECBU process flow and structure and compares the performance benefits of ECBU technology verses the existing commercial high performance flip chip solder attach on high density organic chip carriers. Reliability data is presented for both conventional semiconductors with Al pads as well as the advanced Cu/Low-K advanced semiconductors. Modeling results of the ECBU structure is presented to show the influence of both process conditions and materials on the final package flatness. Experimental data is shown to confirm the model.