COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING COPPER ALLOY SHEET MATERIAL

摘要

To provide an inexpensive copper alloy sheet material which is excellent in heat resistance to the same degree as that of a conventional technique, in which crystal grains do not become larger than a certain degree even when having been heated to high temperature, and which is also excellent in electric conductivity; and its related technology.SOLUTION: The copper alloy sheet material includes 0.0005 mass% or more and 0.1 mass% or less Ni, 0.0005 mass% or more and 0.1 mass% or less Sn, 100 ppm or less C, 800 ppm or less O, 10 ppm or less H, and 50 ppm or less Ag, with the balance being Cu and impurity. A total of contents of the Ni and the Sn is 0.001 mass% or more and 0.11 mass% or less; and when the content of the impurity is expressed as A to B (ppm) in consideration of a quantitative lower limit of each element, where A is a total value of impurity contents when the content of the element less than the quantitative lower limit is regarded as 0 ppm, and B is a total value of the impurity contents when the content of the element less than the quantitative lower limit is regarded as a quantitative lower limit of each element, A is 100 or less, and B is 250 or less.SELECTED DRAWING: None