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PRODUCTION OF A COLLECTOR FOR MICROELECTRONIC DEVICE

机译:微电子器件集电极的研制

摘要

The present invention relates to a method for producing a microelectronic device comprising successively: a formation of a first current collector on a face of a substrate; - forming a first electrode (14) on and in electrical continuity with a portion of the first current collector; a heat treatment configured to process the first electrode (14) characterized by the fact that: the formation of the first collector comprises forming a first collector layer (12) on the face of the substrate and forming a second collector layer (13) covering at least a portion, referred to as the coated portion, of the first layer (12) of collector and having a first face in contact with the first electrode (14), the second collector layer (13) is configured to protect the coated portion during the heat treatment, so that the heat treatment does not oxidize said coated portion.
机译:本发明涉及一种用于生产微电子器件的方法,该方法依次包括:在基板表面上形成第一集电器在第一集电器的一部分上形成第一电极(14)并与之电连续;一种用于处理第一电极(14)的热处理,其特征在于:第一集电体的形成包括在基板表面上形成第一集电体层(12),以及形成覆盖至少一部分的第二集电体层(13),该部分称为涂覆部分,在收集器的第一层(12)中,第二收集器层(13)具有与第一电极(14)接触的第一面,第二收集器层(13)被配置为在热处理期间保护涂层部分,以便热处理不会氧化所述涂层部分。

著录项

  • 公开/公告号EP3503142B1

    专利类型

  • 公开/公告日2022-04-27

    原文格式PDF

  • 申请/专利权人

    申请/专利号EP20180213771

  • 申请日2018-12-18

  • 分类号H01G11/04;H01G11/28;H01G11/68;H01G11/70;H01G11/84;

  • 国家 EP

  • 入库时间 2022-08-25 00:43:38

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