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Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
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机译:混合钎料合金粉低温熔融和中温熔融无铅焊膏
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摘要
Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.
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