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LIGHT-emitting HALF-LEADER ELEMENT AND LIGHT-emitting HALF-LEADER ELEMENT

机译:发光半导体元素和发光半导体元素

摘要

A semiconductor light-emitting element (20) includes: a semiconductor stack (30) including an n-type layer (32) and a p-type layer (36) and having at least one n exposure portion (30e) being a recess where the n-type layer (32) is exposed; a p wiring electrode layer (42) on the p-type layer (36); an insulating layer (44) (i) continuously covering inner lateral surfaces (30s) of at least one n exposure portion (30e) and part of a top surface of the p wiring electrode layer (42) and (ii) having an opening portion (44a) that exposes the n-type layer (32); an n wiring electrode layer (46) disposed above the p-type layer (36) and the p wiring electrode layer (42) and in contact with the n-type layer (32) in the opening portion (44a); and at least one first n connecting member (51). At least one first n connecting member (51) is connected to the n wiring electrode layer (46) in at least one first n terminal region (51r). The n wiring electrode layer (46) and the p-type layer (36) are disposed below at least one first n terminal region (51r).
机译:半导体发光元件(20)包括:半导体堆叠(30),包括n型层(32)和p型层(36),并且具有至少一个n曝光部分(30e)是凹槽在哪里n型层(32)暴露; P型层(36)上的P接线电极层(42);连续地覆盖至少一个n曝光部分(30e)的内侧表面(30s)的绝缘层(44)(i)以及具有开口部分的P接线电极层(42)的顶表面的一部分和(ii)的一部分(44a)暴露n型层(32); N布线电极层(46)设置在P型层(36)和P接线电极层(42)上方,与开口部分(44A)中的N型层(32)接触;和至少一个第一n连接构件(51)。至少一个第一n连接构件(51)在至少一个第一n个端子区域(51r)中连接到N布线电极层(46)。 n布线电极层(46)和p型层(36)设置在至少一个第一N端子区域(51r)下方。

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