Deposition of electrolyte and copper barrier in Damascus process

摘要

Deposition of electrolyte and copper barrier in Damascus processThe invention relates to an electrolyte and its application in copper interconnection manufacturing process. Electrolytes with pH greater than 6.0 include copper ions, manganese ions or zinc ions, and ethylenediamine complexed with copper.After annealing, the coated copper alloy forms a thin barrier layer, which makes manganese or zinc migrate on the interface between insulating dielectric material and copper.