Water vapor treatment stations for chemical mechanical polishing systems

摘要

An apparatus for water vapor treatment of a carrier head or substrate in a chemical mechanical polishing system, comprising: a load cup, a pedestal in a cavity defined by the load cup, the pedestal receiving a substrate from or supplying a substrate to the carrier head configured - a boiler for producing water vapor, one or more nozzles positioned to direct water vapor inwardly into a cavity defined by a rod cup, and a supply line leading from the boiler to the one or more nozzles to supply water vapor to the one or more nozzles includes