首页> 外国专利> WATER SYSTEM DISPERSING ELEMENT FOR CHEMICAL-MECHANICAL POLISHING AND CHEMICAL-MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING WATER SYSTEM DISPERSING ELEMENT FOR CHEMICAL-MECHANICAL POLISHING

WATER SYSTEM DISPERSING ELEMENT FOR CHEMICAL-MECHANICAL POLISHING AND CHEMICAL-MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING WATER SYSTEM DISPERSING ELEMENT FOR CHEMICAL-MECHANICAL POLISHING

机译:用于化学机械抛光的水系统分散元素和化学机械抛光方法,以及用于化学机械抛光的水系统分散元素的制备工具包

摘要

PROBLEM TO BE SOLVED: To provide a water system dispersing element for chemical-mechanical polishing and a chemical-mechanical polishing method that are capable of efficiently polishing each of various objects to be polished and obtaining a fully planarized and accurately finished surface and where dishing and erosion will not worsen in wiring portions, if chemical-mechanical polishing is conducted for more than an optimal polishing time, and a kit for preparing the water system dispersing element for chemical-mechanical polishing.;SOLUTION: The water system dispersing element for chemical mechanical polishing includes (A) grain, (B) an organic acid, (C) benzotriazole or its derivatives, (D) poly(meta)acrylate, (E) an oxidizer, and (F) water, and the blended quantity of (A) grain is 2-10 wt.%.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种用于化学机械抛光的水系统分散元件和一种化学机械抛光方法,它们能够有效地抛光各个待抛光物体,并获得完全平坦且精确抛光的表面,以及在其上产生凹陷和凹陷的地方。如果进行化学机械抛光的时间超过最佳抛光时间,并准备用于化学机械抛光的水系统分散元件的套件,则布线部分的腐蚀不会加剧;解决方案:化学机械的水系统分散元件抛光包括(A)颗粒,(B)有机酸,(C)苯并三唑或其衍生物,(D)聚(甲基)丙烯酸酯,(E)氧化剂和(F)水以及(A)的混合量)谷物含量为2-10 wt。%.;版权所有:(C)2007,日本特许厅和INPIT

著录项

  • 公开/公告号JP2006287207A

    专利类型

  • 公开/公告日2006-10-19

    原文格式PDF

  • 申请/专利权人 JSR CORP;

    申请/专利号JP20060048946

  • 申请日2006-02-24

  • 分类号H01L21/304;B24B37/00;C09K3/14;

  • 国家 JP

  • 入库时间 2022-08-21 21:57:08

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