CHEMICAL MECHANICAL POLISHING WATER DISPERSING ELEMENT, KIT FOR PREPARING CHEMICAL MECHANICAL POLISHING WATER DISPERSING ELEMENT, AND METHOD OF POLISHING CHEMICAL MACHINE

摘要

PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing water dispersing element capable of securing the in-plane uniformity of polishing speed and suppressing a variation in the in-plane flatness of a surface to be polished in a process for polishing, by a chemical machine, a wiring layer which is formed on a substrate for an electro-optic display and which is formed of copper or a copper alloy, a kit for preparing the chemical mechanical polishing water dispersing element, and a chemical mechanical polishing method using the chemical mechanical polishing water dispersing element.;SOLUTION: This chemical mechanical polishing water dispersing element comprises (A) at least one of amidosulfuric acid and its bases, (B) a surface active agent which is one of alkylbenzene sulfonic acid, alkyl naphthalene sulfonic acid, α-olefin sulfonic acid, and their bases, (C) abrasive grains, (D) amino acid, and (E) oxidizer.;COPYRIGHT: (C)2010,JPO&INPIT