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Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
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机译:混合晶圆切割方法采用分体梁激光划线工艺和等离子体蚀刻工艺
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摘要
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.
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