Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured to generate a rendered image based on information about a design printed on the wafer. The rendered image is a simulation of the image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) is also configured to compare the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on a wafer using a reticle. Further, the computer subsystem(s) is configured to detect defects on the wafer based on the comparison result.
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