A method and system for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured to generate rendered images based on information about the designs printed on the wafers. The rendered image is a simulation of the image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem (s) are also configured to compare the rendered image with an optical image of the wafer produced by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem (s) are configured to detect faults on the wafer based on the results of the comparison.
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