METHOD FOR OBTAINING INFORMATION ABOUT A LAYER OF AN ORGANIC SOLDERABILITY PRESERVATIVE ON A PRINTED CIRCUIT BOARD

摘要

A method for obtaining information about a layer of an organic solderability preservative, OSP, on a printed circuit board, PCB, the method comprising • Providing a PCB (16) having a copper layer (18), wherein a solder resist (19) is placed on the copper layer (18), and the solder resist (19) has openings (21) wherein in the openings (21) a copper surface of the copper layer (18) is covered by a layer of an OSP, • Providing a fluorescence measuring system (10), comprising a radiation source (11), a detection unit (12), and a movement device (24), the method comprising: • a) Obtaining (S2) information about the location of the openings (21) on the PCB (16), • b) Selecting (S3) at least one of the openings (21), • c) Placing (S4) the radiation source (11) at such position that the radiation beam (22) irradiates into the at least one selected opening (21) on the layer of the OSP (20), • d) Detecting (S5) the fluorescent radiation (23) emitted from the OSP (20).