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DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES

机译:定向自组装结构和技术

摘要

Disclosed herein are structures and techniques utilizing directed self-assembly for microelectronic device fabrication. For example, a microelectronic structure may include a patterned region including a first conductive line and a second conductive line, wherein the second conductive line is adjacent to the first conductive line; and an unordered region having an unordered lamellar pattern, wherein the unordered region is coplanar with the patterned region.
机译:本文公开了利用用于微电子器件制造的定向自组装的结构和技术。 例如,微电子结构可以包括包括第一导线和第二导线的图案化区域,其中第二导线与第一导线相邻; 和具有无序层状图案的无序区域,其中,无序区域与图案化区域共面。

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