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Composition for forming a resist underlayer film, a resist underlayer film, a method for forming a resist underlayer film, a method for manufacturing a patterned substrate, and a compound

机译:用于形成抗蚀剂底层膜的组合物,抗蚀剂底层膜,形成抗蚀剂底层膜的方法,一种制造图案化底物的方法,以及化合物

摘要

It is an object to provide a composition for forming a resist underlayer film capable of forming a resist underlayer film having excellent etching resistance, heat resistance, flatness and bending resistance, a resist underlayer film, a method for forming a resist underlayer film, a method for manufacturing a patterned substrate, and a compound . The composition for resist underlayer film formation containing the compound which has group represented by following formula (1), and a solvent. In the following formula (1), R 1 and R 2 are each independently a substituted or unsubstituted aryl group having 6 to 30 reduced numbers or a substituted or unsubstituted heteroaryl group having 5 to 30 reduced numbers. R 3 is a hydrogen atom or a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms. * represents a binding site with a moiety other than the group represented by the following formula (1) in the compound.
机译:本发明的目的是提供一种用于形成能够形成具有优异蚀刻电阻,耐热性,平坦度和弯曲性的抗蚀剂底层膜的抗蚀剂底层膜的组合物,耐热性,平坦度和抗弯性,抗蚀剂底层膜,一种形成抗蚀剂底层膜的方法,一种方法 用于制造图案化的基材和化合物。 含有化合物的抗蚀剂底层膜形成的组合物,该化合物具有下式(1)表示的基团,以及溶剂。 在下式(1)中,R 1和R 2各自独立地是具有6至30个还原数量的取代或未取代的芳基,或具有5至30个减少数的取代或未取代的杂芳基。 R 3是具有1至10个碳原子的氢原子或取代或未取代的一价脂族烃基。 *表示具有除由下式(1)中的基团以外的部分的结合位点。

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