CSP CSPMETHOD FOR MANUFACTURING PIXEL CHIP SCALE PACKAGE WITH EXTENDED ELECTRODE PAD AND PIXEL CHIP SCALE PACKAGE MANUFACTURED BY THAT METHOD

摘要

The present invention relates to a method of manufacturing a pixel CSP and a pixel CSP, and more particularly, to a method of manufacturing a pixel CSP having an extended electrode pad and a pixel CSP manufactured according to the manufacturing method. In the method of manufacturing a pixel CSP having an extended electrode pad according to an embodiment of the present invention, a plurality of openings arranged in a matrix form are formed in a frame having a predetermined shape, and one or more pixel CSPs including a light emitting device in the plurality of openings forming a pixel CSP array; and an extended metal deposition step of depositing a metal in an area extended from the electrode pad by attaching a shadow mask to the frame surface on the electrode pad side of the pixel CSP.