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CMP CMP POLISHING PAD HAVING EDGE EXCLUSION REGION OF OFFSET CONCENTRIC GROOVE PATTERN
CMP CMP POLISHING PAD HAVING EDGE EXCLUSION REGION OF OFFSET CONCENTRIC GROOVE PATTERN
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机译:CMP CMP抛光垫,具有偏移同心槽图案的边缘排除区域
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摘要
The present invention provides a polishing pad and a method of using the polishing pad to chemically-mechanically polish a substrate. The polishing pad includes at least a grooved region and a non-grooved exclusion region adjacent a circumference of the polishing pad.
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