首页> 外国专利> 3D Electronic device in which housing is formed by 3D printing method

3D Electronic device in which housing is formed by 3D printing method

机译:3D电子设备,其中壳体由3D打印方法形成

摘要

The present invention relates to an electronic device in which a housing is formed by a 3D printing method. An electronic device according to an exemplary embodiment of the present invention includes: a housing formed of an insulating material and including an output portion formed by a 3D printing method; and a conductive pattern part coupled to the surface of the housing and including an output pattern coupled to the output part and an extension pattern connected to the output pattern, wherein the output pattern is formed together with the output part by a 3D printing method. can
机译:本发明涉及一种电子装置,其中壳体由3D打印方法形成。 根据本发明示例性实施例的电子设备包括:由绝缘材料形成并且包括由3D印刷方法形成的输出部分形成的壳体; 和耦合到壳体表面的导电图案部分,并且包括耦合到输出部分的输出图案和连接到输出图案的延伸图,其中通过3D打印方法与输出部分一起形成输出图案。 能够

著录项

  • 公开/公告号KR102293941B1

    专利类型

  • 公开/公告日2021-08-26

    原文格式PDF

  • 申请/专利权人 (주)파트론;

    申请/专利号KR20190149504

  • 发明设计人 이광성;이충현;

    申请日2019-11-20

  • 分类号B29C64/10;B29C64/30;B33Y80;H01Q1/12;

  • 国家 KR

  • 入库时间 2024-06-14 22:23:43

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号