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3D Electronic device in which housing is formed by 3D printing method
3D Electronic device in which housing is formed by 3D printing method
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机译:3D电子设备,其中壳体由3D打印方法形成
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摘要
The present invention relates to an electronic device in which a housing is formed by a 3D printing method. An electronic device according to an exemplary embodiment of the present invention includes: a housing formed of an insulating material and including an output portion formed by a 3D printing method; and a conductive pattern part coupled to the surface of the housing and including an output pattern coupled to the output part and an extension pattern connected to the output pattern, wherein the output pattern is formed together with the output part by a 3D printing method. can
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