Temporarily fixing resin composition, temporarily fixing resin film and temporarily fixing sheet and method for manufacturing a semiconductor device

摘要

The resin composition for temporarily fixing according to the present invention, a temporarily fixing process for temporarily fixing a semiconductor wafer to a support through a temporary fixing material, a processing step of processing the semiconductor wafer temporarily fixed to the support, and separating the semiconductor wafer after processing from the temporarily fixing material In the processing method of a semiconductor wafer including a separation process, it is for forming a temporarily fixed material, (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, including the shear viscosity at 120 ° C. is 4000 Pa·s or less, and the rate of change of shear viscosity after leaving it to stand for 7 days in an atmosphere of 25°C is within 30%.