RESIN COMPOSITION FOR TEMPORARY FIXING USE, RESIN FILM FOR TEMPORARY FIXING USE, SHEET FOR TEMPORARY FIXING USE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of temporarily fixing the semiconductor wafer onto a support with the temporary fixing material interposed therebetween, a processing step of processing the semiconductor wafer that has been temporarily fixed onto the support, and a separation step of separating the processed semiconductor wafer from the temporary fixing material, the resin composition comprising (A) a thermoplastic resin, (B) a heat-curable resin and (C) a silicone compound, and having a shear viscosity of 4000 Pa・s or less at 120°C, wherein the change ratio of the shear viscosity of the resin composition after the resin composition is allowed to leave under an atmosphere having a temperature of 25°C for seven days is within 30%.