Manufacturing method of temporary fixing resin composition, temporary fixing resin film, temporary fixing resin film sheet and semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for temporarily fixing that makes it possible to form a temporary fixing material layer that can sufficiently fix a semiconductor chip and a sealing body thereof to a support and that can be easily peeled from the semiconductor chip and the sealing body after processing, a resin film for temporarily fixing and a resin film sheet for temporarily fixing prepared with the resin composition for temporarily fixing, and a method for producing a semiconductor device.SOLUTION: A resin composition for temporarily fixing contains a thermoplastic resin and a silicone compound and is used for temporarily fixing a semiconductor chip, and a sealing body that seals the semiconductor chip.SELECTED DRAWING: None