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Curable resin composition for peeling sheet, process substrate using the same, and method for protecting substrate
Curable resin composition for peeling sheet, process substrate using the same, and method for protecting substrate
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机译:用于剥离片材的可固化树脂组合物,使用相同的工艺衬底,以及保护基材的方法
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摘要
PROBLEM TO BE SOLVED: To provide a resin composition for peeling sheets, which is cured to give a peeling sheet having excellent adhesion and flexibility.;SOLUTION: A curable resin composition contains (A) a thioether containing (meth) acrylate derivative represented by the following (formula 1), (B) a polyfunctional (meth) acrylate with a weight average molecular weight of 200-50000, and (C) a polyether modified polydimethylsiloxane.;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT
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