STEPPED COMPONENT ASSEMBLY ACCOMMODATED WITHIN A STEPPED CAVITY IN COMPONENT CARRIER

摘要

This document describes an electronic package (100, 200a, 200b, 500, 600, 700, 900) comprising (a) a component carrier (110, 210, 410, 510, 610, 910) having a stepped cavity (130, 430, 830) formed therein; and (b) a component assembly (150, 350) comprising at least two electrically connected electronic components (152, 154; 352, 354, 356) having different sizes such that the component assembly (150, 350) has a stepped shape. The component assembly (150, 350) is accommodated at least partially inserted within the stepped cavity (130, 430, 830). Further described is a method for method of manufacturing such an electric package.