POLYPROPYLENE RESIN COMPOSITION FOR HOT-MELT BONDING, AND HOT-MELT ADHESIVE

摘要

Provided are a polypropylene resin composition for hot-melt bonding and a hot-melt adhesive which have excellent adhesiveness and have little fear of unevenness in adhesiveness, coloration, or odor. The polypropylene resin composition for hot-melt bonding includes an ethylene/propylene/non-conjugated polyene copolymer, wherein the ethylene/propylene/non-conjugated polyene copolymer is uncrosslinked, the ethylene/propylene/non-conjugated polyene copolymer has a propylene content of 26-38 mass%, and the ethylene/propylene/non-conjugated polyene copolymer is contained in an amount of 5-80 mass%. The hot-melt adhesive includes the polypropylene resin composition for hot-melt bonding.