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ROBUST INTERFACE FOR COOLER TO HOUSING

机译:冷却器到外壳的强大界面

摘要

An interface system for mechanically decoupling a cooling system includes: a housing having an opening; an inset having opposite first and second sides; an interface body having first and second ends and a bore-hole open to the first and second ends thereof. The inset has a recess in the second side to accommodate the interface body. The interface body is at least partially inserted into the inset, and the inset is at least partially inserted into the opening in the housing such that the first side of the inset is inside the housing. The first side of the inset has an opening open to the bore-hole of the interface body. One end of the bore-hole is configured to slidably receive an inlet of a cooling pipe, and the other end of the bore-hole is configured to be connected, in a fluid-tight manner, with an external coolant supply or coolant discharge.
机译:用于机械解耦冷却系统的界面系统包括:具有开口的壳体; 插入件第一和第二侧面; 具有第一和第二端的界面主体和向其第一和第二端开放的孔洞。 插入物在第二侧具有凹槽以容纳界面主体。 界面主体至少部分地插入插入插入处,并且插入物至少部分地插入壳体中的开口中,使得插入物的第一侧位于壳体内。 插口的第一侧具有开口向界面主体的孔开口。 钻孔的一端构造成可滑动地接收冷却管的入口,并且孔洞的另一端被配置为以流体密封的方式连接,具有外部冷却剂供应或冷却剂排出。

著录项

  • 公开/公告号US2021305643A1

    专利类型

  • 公开/公告日2021-09-30

    原文格式PDF

  • 申请/专利权人 SAMSUNG SDI CO. LTD.;

    申请/专利号US202117217480

  • 发明设计人 HELMUT RATH;

    申请日2021-03-30

  • 分类号H01M10/6568;B60L50/64;H01M10/613;H01M10/625;H01M10/6557;

  • 国家 US

  • 入库时间 2024-06-14 22:08:50

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