Glass powder filling equipment into wafers

摘要

An apparatus for filling glass powder into wafers belonging to the technical field of electronic device production equipment, comprising a support device for supporting the wafer, a loading device (5) and a scraping device (6), the loading device (5) and the scraping device ( 6) are all installed on the upper side of the supporting device, and the picking unit is mounted on the lower side of the loading device (5) to drive the picking unit to move, and the scraper (43) is mounted on the lower side of the scraping device (6) to install the scraper (43) Disclosed is an apparatus for filling glass powder into a wafer, characterized in that it drives to move. In the glass powder filling device to the corresponding wafer, the loading device evenly places the glass powder on the wafer through the picking part, and the scraping device removes the residual glass powder on the wafer through the scraper, thereby ensuring the proper amount of the glass powder on the wafer In addition to preventing the problem that the subsequent processing process becomes complicated due to excessive glass powder, it is also possible to prevent the problem of non-uniform distribution of the glass powder. The yield is improved and the production cost of the product is reduced.