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Connectivity verification for flip-chip and advanced packaging technologies
Connectivity verification for flip-chip and advanced packaging technologies
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机译:倒装芯片和先进包装技术的连接验证
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摘要
The fault detection system described provides an efficient method to test and monitor component to component connectivity in an electronic package using on chip test circuits and on chip components, which reduces the need for external testing equipment and analysis. The on chip nature allows for both real time testing in the assembly process of the electronic packages and during use of the electronic package by determining an on chip reference measurement and using the reference measurement to determine an operational status of the package.
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