MOISTURE-CURABLE HOT MELT COMPOSITION FOR ELECTRICAL/ELECTRONIC COMPONENTS, BONDING AGENT, AND COATING AGENT

摘要

The present invention provides a moisture-curable hot melt composition for electrical/electronic components, which has a short curing time following application, is excellent in terms of tack-free properties, and exhibits excellent high temperature flow resistance and insulation reliability. Specifically, the present invention provides a moisture-curable hot melt composition for electrical/electronic components, which contains a silyl group-containing amorphous polyolefin (A1), a liquid softening agent (B1) and a catalyst (C). The melt viscosity of the hot melt composition at 120ºC is 5000 mPa·s or less. The difference between the storage elastic modulus G' (Pa) and the loss elastic modulus G'' (Pa) at 160°C, as measured using a dynamic viscoelasticity measurement apparatus in rotating shear mode at a vibrational frequency 1 Hz and a temperature increase rate of 5°C/minute within the temperature range -80°C to 200°C, of a cured product obtained by curing the hot melt composition for 72 hours at a temperature of 25°C and a relative humidity of 50% is 1500 Pa or more.