首页> 外国专利> FLAME-RESISTANT MOISTURE-CURABLE RESIN COMPOSITION, FLAME-RESISTANT MOISTURE-CURABLE BONDING AGENT COMPRISING SAID COMPOSITION, AND BONDING METHOD USING SAID BONDING AGENT

FLAME-RESISTANT MOISTURE-CURABLE RESIN COMPOSITION, FLAME-RESISTANT MOISTURE-CURABLE BONDING AGENT COMPRISING SAID COMPOSITION, AND BONDING METHOD USING SAID BONDING AGENT

机译:阻燃耐湿固化树脂组合物,阻燃耐湿固化粘合剂组合物及使用粘接剂的粘接方法

摘要

Disclosed is a flame-resistant, moisture-curable resin composition that is environmentally friendly and has excellent capabilities as a bonding agent, a fixing agent, a sealant, or an adhesive precursor composition for use in the assembly of electrical goods, precision instruments, automobile components, or the like, where flame resistance is required. Also disclosed are a flame-resistant, moisture-curable bonding agent using said flame-resistant, moisture-curable resin composition as an active component, and a bonding method using the bonding agent. The flame-resistant, moisture-curable resin composition is characterized by comprising a mixture of a curable silicone resin (A-1) having an α-silane structure, a metal hydroxide powder (B) with a mean particle size of 0.1 to 200 μm, and an aminosilane compound (C).
机译:公开了一种耐火的,可湿固化的树脂组合物,该组合物是环境友好的,并且具有优异的用作用于电气产品,精密仪器,汽车的组装的粘合剂,固定剂,密封剂或粘合剂前体组合物的能力。需要阻燃性的组件等。还公开了使用所述耐湿可固化树脂组合物作为活性成分的耐湿可固化粘合剂和使用该粘合剂的粘合方法。该耐湿气固化性树脂组合物的特征在于,包含具有α-硅烷结构的固化性硅树脂(A-1)和平均粒径为0.1〜200μm的金属氢氧化物粉末(B)的混合物。和氨基硅烷化合物(C)。

著录项

  • 公开/公告号WO2011089987A1

    专利类型

  • 公开/公告日2011-07-28

    原文格式PDF

  • 申请/专利权人 KONISHI CO. LTD.;

    申请/专利号WO2011JP50620

  • 申请日2011-01-17

  • 分类号C08L101/10;C08K3/22;C08K5/544;C08L33/14;C08L71/02;C09J183/00;C09K3/10;

  • 国家 WO

  • 入库时间 2022-08-21 17:56:29

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