MOISTURE-CURABLE HOT MELT COMPOSITION FOR ELECTRICAL AND ELECTRONIC COMPONENTS, BONDING AGENT AND COATING AGENT

摘要

To provide a moisture-curable hot melt composition for electrical and electronic components, which has a short curing time after application, is excellent in tack-free property and is excellent in high temperature flow resistance and insulation reliability.SOLUTION: There is provided a moisture-curable hot melt composition for electrical and electronic components, which comprises an amorphous polyolefin having a silyl group (A1), a liquid softening agent (B1) and a catalyst (C), wherein the melt viscosity of the hot melt composition at 120°C is 5000 mPa s or less and the difference between the storage elastic modulus G' (Pa) and the loss elastic modulus G'' (Pa) at 160°C, as measured using a dynamic viscoelasticity measurement apparatus in a rotating shear mode at a vibrational frequency of 1 Hz and a temperature increase rate of 5°C/minute within the temperature range -80°C to 200°C of a cured product obtained by curing the hot melt composition for 72 hours at a temperature of 25°C and a relative humidity of 50% is 1500 Pa or more.SELECTED DRAWING: None