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PRINTED CIRCUIT BOARD ASSEMBLIES WITH ENGINEERED THERMAL PATHS AND METHODS OF MANUFACTURE
PRINTED CIRCUIT BOARD ASSEMBLIES WITH ENGINEERED THERMAL PATHS AND METHODS OF MANUFACTURE
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机译:印刷电路板组件,具有工程化热路径和制造方法
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摘要
A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.
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