Printed Circuit Board and Method of Manufacturing a Printed Circuit Board with at Least One Optoelectronic Component Integrated into the Printed Circuit Board

摘要

In an embodiment a method for manufacturing a printed circuit board with at least one optoelectronic component integrated into the printed circuit board includes arranging the at least one optoelectronic component on a first metal layer, pressing a first electrically insulating layer onto the at least one optoelectronic component and creating at least one recess in the first metal layer and/or the first electrically insulating layer thereby at least partially exposing the at least one optoelectronic component, wherein the first electrically insulating layer comprises a fiber reinforced plastic or a glass fiber fabric.