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METHOD TO PREPARE PIXEL FOR UNCOOLED INFRARED FOCAL PLANE DETECTOR

机译:用于制备加工红外焦平面检测器的像素的方法

摘要

An pixel for an uncooled infrared focal plane detector and a preparation method therefor, which relate to the technical field of uncooled infrared focal plane detectors. The pixel for an uncooled infrared focal plane detector comprises a structure of three layers, which are sequentially located on a semiconductor substrate (1) from bottom to top. The first layer of a bridge structure comprises a metal reflection layer (2), an insulation dielectric layer (4), a first supporting layer (6), a first support layer protection layer (7), a first metal electrode layer (9), and a first silicon nitride dielectric layer (10). The second layer of a thermal conversion structure comprises a second support layer (11), a second support layer protection layer (12), a thermal sensitive layer (17), a thermal sensitive layer production layer (18), a second metal electrode layer (14), and a second silicon nitride dielectric layer (15). The third layer of an absorption structure comprises a third support layer (19), an absorption layer (20), and an absorption layer protection layer (21). The pixel for an uncooled infrared focal plane detector can obviously improve the absorption rate of infrared radiation and can improve the response rate of a detector, thereby laying a foundation for manufacturing larger-array and smaller-pixel detectors.
机译:用于未冷却红外焦平面检测器的像素及其制备方法,其涉及未冷却红外焦平面检测器的技术领域。用于未冷却红外焦平面检测器的像素包括三层的结构,其依次位于从底部到顶部的半导体衬底(1)上。桥接结构的第一层包括金属反射层(2),绝缘电介质层(4),第一支撑层(6),第一支撑层保护层(7),第一金属电极层(9) ,以及第一氮化硅介电层(10)。热转换结构的第二层包括第二支撑层(11),第二支撑层保护层(12),热敏层(17),热敏层制作层(18),第二金属电极层(14)和第二氮化硅介电层(15)。吸收结构的第三层包括第三支撑层(19),吸收层(20)和吸收层保护层(21)。用于未冷却的红外焦平面检测器的像素可以明显提高红外辐射的吸收率,并且可以提高检测器的响应速率,从而为制造较大阵列和较小像素检测器铺设了基础。

著录项

  • 公开/公告号EP3522217B1

    专利类型

  • 公开/公告日2021-07-14

    原文格式PDF

  • 申请/专利权人

    申请/专利号EP20160917204

  • 申请日2016-09-29

  • 分类号H01L27/146;

  • 国家 EP

  • 入库时间 2022-08-24 19:55:52

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