首页> 外文会议>Society of Photo-Optical Instrumentation Engineers Conference on Infrared Detectors and Focal Plane Arrays >A Low-Cost Small Pixel Uncooled Infrared Detector for Large Focal Plane Arrays using a Standard CMOS Process
【24h】

A Low-Cost Small Pixel Uncooled Infrared Detector for Large Focal Plane Arrays using a Standard CMOS Process

机译:使用标准CMOS工艺的大型焦平面阵列的低成本小像素未加工红外探测器

获取原文

摘要

This paper reports the development of a low-cost, small pixel uncooled infrared detector using a standard CMOS process. The detector is based on a suspended and thermally isolated p~+-active/n-well diode whose forward voltage changes due to an increase in the pixel temperature with absorbed infrared radiation. The detector is obtained with simple post-CMOS etching steps on dies fabricated using a standard n-well CMOS process. The post-CMOS process steps are achieved without needing any deposition or lithography, therefore, the cost of the detector is almost equal to the cost of the fabricated CMOS chip. Before suspending the pixel using electrochemical etch-stop technique in TMAH, the required etch openings to reach the silicon substrate are created with a simple dry etch process while CMOS metal layers are used as protection mask. Since the etch mask is implemented with available CMOS layers, the etch openings can be reduced significantly, allowing to implement small pixel sizes with reasonable fill factor. This approach is used to implement a 40μmX40μm diode pixel with a fill factor of 44%, suitable for large format FPAs. The p~+-active/n-well diode has a low 1/f noise, due to its single crystal nature and low bias requirement. Optimum pixel performance is achieved when the pixel is biased at 20μA, where self-heating effect is less than 0.5K. Measurements and calculations show that this new detector has a thermal conductance (G_(th)) of 1.4X10~(-7)W/K and provides a responsivity (R) of 5800V/W and a detectivity (D~*) value of 1.9Xl0~9cm(Hz/W)~(1/2) when scanned at 30fps with an electrical bandwidth of 4kHz. If this detector is used to implement a 64x64 or 128x128 FPA with sufficient number of parallel readout channels, these FPAs will provide an NETD value of 195mK considering only the detector noise. When the readout noise is included, these FPAs are expected to provide NETD value below 300mK. Such FPAs are very suitable for ultra low-cost infrared imaging applications.
机译:本文报告了使用标准CMOS工艺的低成本,小像素未加工红外探测器的开发。检测器基于悬浮和热分离的P〜+ + - 孔二极管,其前向电压由于具有吸收的红外辐射的像素温度的增加而变化。通过使用标准N-孔CMOS工艺制造的模具的简单CMOS蚀刻步骤获得检测器。在不需要任何沉积或光刻的情况下实现了后CMOS工艺步骤,因此,检测器的成本几乎等于制造的CMOS芯片的成本。在使用TMAH中使用电化学蚀刻停止技术悬挂像素之前,使用简单的干蚀刻工艺产生要到达硅衬底的所需蚀刻开口,而CMOS金属层用作保护掩模。由于蚀刻掩模用可用的CMOS层实现,因此可以显着降低蚀刻开口,从而允许使用合理的填充因子实现小像素尺寸。这种方法用于实现40μmx40μm二极管像素,其填充因子为44%,适用于大型FPA。 P〜+ - + - + N阱二极管具有低1 / f噪声,由于其单晶性质和低偏置要求。当像素偏置在20μA时,实现最佳像素性能,其中自加热效果小于0.5K。测量和计算表明,该新检测器具有1.4×10〜(-7)W / K的热传导(G_(TH)),并提供5800V / W的响应(R)和探测(D〜*)值1.9XL0〜9cm(Hz / W)〜(1/2)在30fps扫描时,带有4kHz的电气带宽。如果该检测器用于实现具有足够数量的并行读数通道的64x64或128x128 FPA,则这些FPA将提供195MK的NETD值,考虑检测器噪声。当包括读出噪声时,这些FPA预计将提供低于300MK的NET值。这种FPA非常适合超低成本红外成像应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号