首页> 外国专利> SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF FORMING THE SAME

SCHOTTKY BARRIER DIODE WITH REDUCED LEAKAGE CURRENT AND METHOD OF FORMING THE SAME

机译:肖特基势垒二极管,漏电流降低和形成相同的方法

摘要

A method of manufacturing a Schottky barrier diode includes: forming a first well region over a substrate; forming a first dielectric layer over the first well region; patterning the first dielectric layer by reducing a first thickness of the first dielectric layer; removing the first dielectric layer to expose a surface of the first well region; and forming a conductive layer over the first well region to obtain a Schottky barrier interface. A Schottky barrier diode manufactured based on the above method is also provided.
机译:一种制造肖特基势垒二极管的方法包括:在基板上形成第一阱区;在第一阱区形成第一介电层;通过减小第一介电层的第一厚度来图案化第一介电层;去除第一介电层以暴露第一阱区的表面;在第一阱区上形成导电层以获得肖特基屏障界面。还提供了基于上述方法制造的肖特基势垒二极管。

著录项

  • 公开/公告号US2021202716A1

    专利类型

  • 公开/公告日2021-07-01

    原文格式PDF

  • 申请/专利权人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.;

    申请/专利号US201916730342

  • 发明设计人 MENG-HAN LIN;TE-AN CHEN;

    申请日2019-12-30

  • 分类号H01L29/66;H01L27/06;H01L29/06;H01L29/47;H01L29/872;H01L21/02;H01L21/225;H01L21/265;H01L21/324;H01L21/285;H01L21/311;H01L21/762;H01L21/768;H01L21/8234;

  • 国家 US

  • 入库时间 2022-08-24 19:41:52

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