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Method of forming copper alloy sputtering targets with refined shape and microstructure
Method of forming copper alloy sputtering targets with refined shape and microstructure
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机译:用精制形状和微观结构形成铜合金溅射靶的方法
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摘要
A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650° C. to about 750° C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500° C. to about 650° C. to form a copper alloy.
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