METHOD OF FORMING COPPER ALLOY SPUTTERING TARGETS WITH REFINED SHAPE AND MICROSTRUCTURE

摘要

A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650°C to about 750°C, subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500°C to about 650°C to form a copper alloy.