首页>
外国专利>
Method for forming a copper alloy sputtering target having a refined shape and microstructure
Method for forming a copper alloy sputtering target having a refined shape and microstructure
展开▼
机译:具有精细形状和微结构的铜合金溅射靶的形成方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
Subjecting the copper manganese billet to a first one-way forging step, heating the copper manganese billet to a temperature of about 650° C. to about 750° C., subjecting the copper manganese billet to a second one-way forging step, and about 500° C. And heating the copper manganese billet to a temperature of about 650° C. to form a copper alloy.
展开▼