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Method for forming a copper alloy sputtering target having a refined shape and microstructure

机译:具有精细形状和微结构的铜合金溅射靶的形成方法

摘要

Subjecting the copper manganese billet to a first one-way forging step, heating the copper manganese billet to a temperature of about 650° C. to about 750° C., subjecting the copper manganese billet to a second one-way forging step, and about 500° C. And heating the copper manganese billet to a temperature of about 650° C. to form a copper alloy.
机译:使铜锰坯经受第一单向锻造步骤,将铜锰坯加热至约650℃至约750℃的温度,使铜锰坯经受第二单向锻造步骤,以及在约500℃的温度下加热铜锰坯料至约650℃的温度以形成铜合金。

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