首页>
外国专利>
VARIATION OF METAL LAYER STACK UNDER UNDER BUMP METALLIZATION (UBM)
VARIATION OF METAL LAYER STACK UNDER UNDER BUMP METALLIZATION (UBM)
展开▼
机译:碰撞金属化下金属层堆叠的变化(UBM)
展开▼
页面导航
摘要
著录项
相似文献
摘要
In certain aspects, a chip includes a pad, and a first passivation layer, wherein a first portion of the first passivation layer extends over a first portion of the pad. The chip also includes a first metal layer between the first portion of the pad and the first portion of the first passivation layer. The chip further includes an under bump metallization (UBM) electrically coupled to a second portion of the pad.
展开▼