首页> 外国专利> MICRO-NANO STRUCTURE ASSEMBLY MANUFACTURING METHOD, AND MICRO-NANO STRUCTURE ASSEMBLY MANUFACTURED BY MEANS OF SAME

MICRO-NANO STRUCTURE ASSEMBLY MANUFACTURING METHOD, AND MICRO-NANO STRUCTURE ASSEMBLY MANUFACTURED BY MEANS OF SAME

机译:微纳米结构组件制造方法,通过该微纳结构组件制造

摘要

A method for manufacturing a micro-nano structure assembly, comprising: providing a filter membrane; providing an MEMS sensor, wherein the MEMS sensor is provided with an opening and can perform sensing by means of the opening; and bonding the filter membrane onto the MEMS sensor, so that the filter membrane covers the opening. The method for providing the filter membrane comprises: coating a substrate (108) with a filter membrane material layer (107), and then coating the filter membrane material layer with a photoresist layer (106); heating the substrate (108) to soften the photoresist layer; using a mold to pressurize the substrate (108), wherein the mold consists of a pattern layer (104) and a back layer (102) that are superimposed, and the back layer is pressurized to make the pattern layer be in contact with the photoresist layer; when continuously using the mold to pressurize the photoresist layer, cooling the photoresist layer to solidify the photoresist layer so as to form, on the photoresist layer, a pattern conforming to the pattern layer; removing the mold; by means of dry etching, removing a photoresist remaining on the pattern; and using the photoresist layer as a mask to perform dry etching or wet etching on the filter membrane material layer (107) so as to transfer the pattern of the photoresist layer onto the filter membrane material layer.
机译:一种制造微纳米结构组件的方法,包括:提供滤膜;提供MEMS传感器,其中MEMS传感器设置有开口,并且可以通过开口进行感测;并将过滤膜粘合到MEMS传感器上,使得过滤膜覆盖开口。提供滤膜的方法包括:用滤膜材料层(107)涂覆基板(108),然后用光致抗蚀剂层(106)涂覆过滤膜材料层;加热基板(108)以软化光致抗蚀剂层;使用模具来加压基板(108),其中模具由图案层(104)和叠加的后层(102)组成,并且后层被加压以使图案层与光致抗蚀剂接触层;当连续使用模具加压光致抗蚀剂层时,冷却光致抗蚀剂层以固化光致抗蚀剂层以形成符合图案层的图案;去除模具;通过干蚀刻,除去留在图案上的光致抗蚀剂;并使用光致抗蚀剂层作为掩模在过滤膜材料层(107)上进行干蚀刻或湿法蚀刻,以将光致抗蚀剂层的图案转移到过滤膜材料层上。

著录项

  • 公开/公告号WO2021082051A1

    专利类型

  • 公开/公告日2021-05-06

    原文格式PDF

  • 申请/专利权人 WEIFANG GOERTEK MICROELECTRONICS CO. LTD.;

    申请/专利号WO2019CN116565

  • 发明设计人 LIN YUJING;

    申请日2019-11-08

  • 分类号H04R19;

  • 国家 CN

  • 入库时间 2022-08-24 18:37:20

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