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Manufacturing method of micro LED display and micro LED display

机译:微LED显示器和微LED显示器的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip integrated device capable of manufacturing various semiconductor chip integrated devices such as a micro LED display at low cost, and to provide such a semiconductor chip integrated device. SOLUTION: A droplet-shaped semiconductor chip containing a semiconductor chip 40 and a liquid 50 having a first electrode and a second electrode on an upper surface and a lower surface so that the second electrode side is more strongly attracted to a magnetic field. The ink 200 is supplied to the chip coupling portion on the lower electrode 420 provided on the mounting substrate 400, and the second electrode side of the semiconductor chip 40 in the semiconductor chip ink 200 is attracted by magnetic force to the chip coupling portion by an external magnetic field. After being brought into contact with each other, they are electrically and mechanically bonded to the chip coupling portion by soldering or the like. After that, a plurality of branch line portions extend from the trunk line portion so as to cover the chip coupling portion to form an upper electrode, and the semiconductor chip 40 is connected between the lower electrode 420 and the upper electrode to manufacture a semiconductor chip integration device. [Selection diagram] FIG. 9
机译:要解决的问题:提供一种制造一种制造能够以低成本制造诸如微LED显示器的各种半导体芯片集成装置的半导体芯片集成装置的方法,并且提供这种半导体芯片集成装置。溶液:液滴形半导体芯片,其包含半导体芯片40和具有第一电极的液体50和上表面上的第二电极和下表面,使得第二电极侧更强烈地吸引到磁场。墨水200被提供给设置在安装基板400上的下电极420上的芯片耦合部分,并且半导体芯片墨水200中的半导体芯片40的第二电极侧被磁力通过磁力吸引到芯片耦合部分上外部磁场。在彼此接触之后,它们通过焊接等电和机械地粘合到芯片耦合部分。之后,多个分支线部分从中继线部分延伸,以便覆盖芯片耦合部分以形成上电极,并且半导体芯片40连接在下电极420和上电极之间以制造半导体芯片集成设备。 [选择图]图。 9.

著录项

  • 公开/公告号JP2021071595A

    专利类型

  • 公开/公告日2021-05-06

    原文格式PDF

  • 申请/专利权人 アルディーテック株式会社;

    申请/专利号JP20190198092

  • 发明设计人 竹谷 元伸;

    申请日2019-10-31

  • 分类号G09F9;G09F9/33;H01L21/58;H01L33;H01L33/02;H05K1/18;

  • 国家 JP

  • 入库时间 2022-08-24 18:36:12

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