首页> 外国专利> METHOD OF MANUFACTURING MICRO LED ARRAY, METHOD OF MANUFACTURING MICRO LED DISPLAY, AND MICRO LED ARRAY, AND MICRO LED DISPLAY

METHOD OF MANUFACTURING MICRO LED ARRAY, METHOD OF MANUFACTURING MICRO LED DISPLAY, AND MICRO LED ARRAY, AND MICRO LED DISPLAY

机译:制造微型LED阵列的方法,制造微型LED显示器,微型LED阵列和微型LED显示器的方法

摘要

To manufacture a micro LED array and a micro LED display easily, with high precision, with high yield, and with high throughput without damaging a micro LED without using solder bonding or wire bonding.SOLUTION: A manufacturing method of a micro LED array includes a step of arranging a plurality of micro LEDs having electrodes formed on one surface side at predetermined positions of support substrates such that the electrodes of the micro LEDs face the support substrate, a step of forming a light transmitting body so as to bury the micro LED, a step of separating the support substrate from the light transmitting body and the micro LED, and exposing the electrodes of the micro LED held by the light transmitting body, and a step of forming wiring of a predetermined pattern electrically connected to the electrode on a part of one surface side of the light-transmitting body and the electrode of the micro LED exposed from the light-transmitting body.SELECTED DRAWING: Figure 5
机译:为了在不使用焊料键合或引线键合的情况下容易地,高精度,高产量和高产量地制造微型LED阵列和微型LED显示器而不会损坏微型LED。解决方案:微型LED阵列的制造方法包括:将多个具有在一个表面侧上形成有电极的微型LED布置在支撑基板的预定位置处以使微型LED的电极面对支撑基板的步骤;形成光透射体以掩埋微型LED的步骤,步骤:将支撑基板与透光体和微型LED分离,并暴露由透光体保持的微型LED的电极;以及在一部分上形成与电极电连接的预定图案的布线的步骤;透光体的一个表面侧和从透光体露出的微型LED的电极。图5

著录项

  • 公开/公告号JP2020043209A

    专利类型

  • 公开/公告日2020-03-19

    原文格式PDF

  • 申请/专利权人 TOHOKU UNIV;TOHOKU MICROTEC CO LTD;

    申请/专利号JP20180169040

  • 发明设计人 FUKUSHIMA TAKASHI;MOTOYOSHI MAKOTO;

    申请日2018-09-10

  • 分类号H01L33/62;H01L33/32;H01L23/12;G09F9/30;G09F9/33;G09F9;

  • 国家 JP

  • 入库时间 2022-08-21 11:37:29

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号