首页> 外国专利> MICROLED MOUNTING STRUCTURE, MICROLED DISPLAY, AND MICROLED DISPLAY MANUFACTURING METHOD

MICROLED MOUNTING STRUCTURE, MICROLED DISPLAY, AND MICROLED DISPLAY MANUFACTURING METHOD

机译:中缝安装结构,中缝显示和中缝显示制造方法

摘要

This MicroLED mounting structure comprises: a wiring board 4 that has, on one side thereof, electrode parts 7 arranged according to a predetermined array; and a microLED 3 that is provided so as to correspond to the positions of the electrode parts 7, that emits light of a specified spectrum from the ultraviolet wavelength band to the blue wavelength band, that has, on one surface of mutually opposed surfaces thereof, electrodes 31a, 31b which are electrically connected to the electrode parts 7, and that has, on another surface thereof, a light emission surface 32 which projects emitted light. The electrodes 31a, 31b and the electrode parts 7 are bonded via a conductive, thermosetting first adhesive 6. All or part of the peripheral lateral surface of the microLED 3 is enclosed and bonded by an insulating, thermosetting second adhesive 8. The microLED 3 is fixed to the wiring board via the second adhesive 8. Due to this configuration, provided is a means for reliably bonding and electrically connecting the electrodes of the microLED to the electrode parts of the wiring board and for reliably connecting the microLED to the wiring board.
机译:该MicroLED安装结构包括:布线板4,在其一侧上具有以预定的阵列布置的电极部7;设置有与电极部7的位置相对应的microLED 3,该microLED 3发射从紫外线波长带到蓝色波长带的指定光谱的光,并且在其彼此相对的表面的一个表面上具有:电极31a,31b电连接到电极部分7,并且在其另一表面上具有发射发射光的发光表面32。电极31a,31b和电极部分7通过导电的,热固性的第一粘合剂6粘合。microLED3的全部或部分外围侧面被绝缘的,热固性的第二粘合剂8包围并粘合。通过第二粘合剂8固定到布线板上。由于这种构造,提供了一种用于可靠地将微型LED的电极接合和电连接到布线板的电极部分并且用于将微型LED可靠地连接到布线板的装置。

著录项

  • 公开/公告号WO2020116207A1

    专利类型

  • 公开/公告日2020-06-11

    原文格式PDF

  • 申请/专利权人 V TECHNOLOGY CO. LTD.;

    申请/专利号WO2019JP45816

  • 申请日2019-11-22

  • 分类号H01L33/36;H01L33/48;H01L33/50;H01L33/62;G09F9/33;

  • 国家 WO

  • 入库时间 2022-08-21 11:10:50

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