Semiconductor chip and semiconductor package, which includes this

摘要

Disclosed embodiments include a semiconductor chip comprising a semiconductor substrate having a top surface with an upper connection pad disposed therein and a protective insulating layer having an opening therein, the protective insulating layer not covering at least a portion of the upper connection pad on the semiconductor substrate. The protective insulating layer may include: a lower protective insulating layer, a top insulating layer having a side cover part that covers at least a portion of a side surface of the lower protective insulating layer, and an upper cover part that is spaced from the side cover part so as to have at least a portion of an upper surface of the lower protective insulating layer covered. The protective insulating layer may further comprise an upper protective insulating layer on the upper cover part.