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Copper alloy strips and their manufacturing methods, resistor materials for resistors using them, and resistors

机译:铜合金条带及其制造方法,电阻材料用于使用它们的电阻和电阻器

摘要

The copper alloy strip of the present invention is a copper alloy strip containing 3% by mass or more and 20% by mass or less of manganese (Mn), and the balance is composed of copper (Cu) and unavoidable impurities. The ratio of the Mn content to the Cu content (surface layer [Mn / Cu] ratio) measured by the spectroscopy in the surface and the surface layer region partitioned by the depth direction from the surface at a position of 0.05 μm is determined. It is characterized by being less than 0.030 in terms of mass ratio, has stable resistance even when the ambient temperature changes, and has good solder mountability.
机译:本发明的铜合金条带是含有3质量%以上的铜合金条带,锰(Mn)的3质量%或更高,并且平衡由铜(Cu)和不可避免的杂质构成。确定由表面上的光谱法测量的Mn含量(表面层[Mn / Cu]比率)与由深度方向从表面分开的表面层区域以0.05μm的位置分开的表面层区域。其特征在于在质量比方面小于0.030,即使环境温度变化也具有稳定的电阻,并且具有良好的焊料可安装性。

著录项

  • 公开/公告号JPWO2020196791A1

    专利类型

  • 公开/公告日2021-04-30

    原文格式PDF

  • 申请/专利权人 古河電気工業株式会社;

    申请/专利号JP20200542680

  • 发明设计人 川田 紳悟;秋谷 俊太;樋口 優;

    申请日2020-03-26

  • 分类号C22C9/05;C22C9/06;C22C9/02;C22C9/04;C22F1/08;C22F1;

  • 国家 JP

  • 入库时间 2024-06-14 21:29:50

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