Photosensitive resin composition, manufacturing method of pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic parts

摘要

(A) a polyimide precursor having a polymerizable unsaturated bond, (B) at least one of the compounds represented by the following formulas (1) to (4), and (C) a photopolymerization initiator represented by the following formula (11). Resin composition. In formulas (1) to (4), R ¹ , R ² and R ⁸ are each independently an alkyl group having 1 to 4 carbon atoms, and R ³ to R ⁷ are each independently a hydrogen atom or 1 to 4 carbon atoms It is an alkyl group of. s is an integer of 0-8, t is an integer of 0-4, and r is an integer of 0-4. In formula (11), R ¹¹ is an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, a phenyl group or a tolyl group, and R ¹² is an alkyl group having 1 to 12 carbon atoms, It is a C4-10 cycloalkyl group, a phenyl group, or a tolyl group, and R ¹³ is a substituted or unsubstituted benzoyl group, a substituted or unsubstituted fluorenyl group, or a substituted or unsubstituted carbazolyl group.